| 发明名称 |
Integrated circuit with active devices under bond pads |
| 摘要 |
Active circuitry is placed under the bond pads in an integrated circuit having at least three metal levels. The metal level adjacent the bond pad level acts as a buffer and provides stress relief and prevents leakage currents between the bond pad and underlying circuitry.
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| 申请公布号 |
US5751065(A) |
申请公布日期 |
1998.05.12 |
| 申请号 |
US19950549990 |
申请日期 |
1995.10.30 |
| 申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
CHITTIPEDDI, SAILESH;COCHRAN, WILLIAM THOMAS;SMOOHA, YEHUDA |
| 分类号 |
H01L27/04;H01L21/3205;H01L21/60;H01L21/822;H01L23/485;H01L23/52;H01L23/544;H01L29/78;(IPC1-7):H01L23/48 |
主分类号 |
H01L27/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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