| 摘要 |
An alignment device for bringing a mask and a wafer into intimate contact with each other for the manufacture of a semiconductor circuit element. In this device, an air-tight chamber is formed between the mask and the wafer. The mask and the wafer are brought into intimate contact with each other by evacuating the airtight chamber. In this case, the mask is made parallel to the wafer or warped toward the wafer. Thus, no non-contact portion is created between the central portions of the mask and the wafer. |
