Cooling device for cooling heat carriers in tempering units, e.g. for moulds or extruders

摘要

A cooling device for cooling heat carriers in tempering units used to temper moulds, extruders etc., comprises a pressure vessel (8) and a pump (11) which advances the heat carrier to an additional container (12) or heat exchanger, where it is cooled and then returned to the vessel (8). When the tempering unit is selected to 'cool', the connection is made to the cooling unit and additional container. In pauses during cooling, there is no thermal connection between the heat carrier of the primary circuit (1) and the cooling unit (7).