High-frequency circuit with integrated logic circuit.
摘要
<p>An h.f. circuit has an integrated logic circuit (3) which is formed as a thin film multilayer circuit on the ceramic, esp. Al2O3, substrate (2) bottom face and incorporating the base metallisation (5) or on the substrate top face. Pref. the thin film multilayer circuit (3) has several metallic wiring layers separated from one another by a polymeric dielectric (32), pref. of polyimide or benzocyclobutene.</p>
