发明名称 METHOD AND APPARATUS FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a method for molding resin with no need of employing molding material molded into tablets, and with the capability of obtaining molded articles having small void failures. SOLUTION: The resin molding method is to inject particulate molding material 2 supplied in a pot 1 from the port 1 to a cavity 4 by an injection plunger 3, in which, at first, the molding material 2 is compressed by clogging circulation from the pot 1 to the cavity 4 and pressurizing molding material 2 within the pot 1 by the plunger 3. Following this, buy opening circulation from the pot 1 to the cavity 4 and pressurizing the molding material 2 within the pot 1 by the plunger, the molding material 2 is injected into the cavity. As such, air among particles of the molding material 2 supplied into the pot 1 is expelled, then molding can be done for injecting the molding material 2 into the cavity 4.
申请公布号 JPH10113947(A) 申请公布日期 1998.05.06
申请号 JP19960272635 申请日期 1996.10.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TANAHASHI YASUNORI;NISHIDE YASUTAKA
分类号 B29C45/33;B29C45/02;B29C45/14;B29C45/28;B29C45/77;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/33
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