| 摘要 |
PROBLEM TO BE SOLVED: To facilitate and assure teaching of bonding position, by extracting a teaching data for a to-be-connected semiconductor device based on the correspondence relationship between a bonding position data and each bonding position, and by teaching it to a wire bonding device. SOLUTION: Relating to a bonding position teaching device, the shapes of a pad 6a and a lead 6b of a to-be-connected semiconductor device 6 are recognized by pattern-recognition with an optical system, and the position of a cursor 2d overlaid on them is decided as a bonding position, so that XY coordinate data of the bonding position is extracted as a position data. A U1 part 4 is operated by an operator who performs teaching to a wire bonding device 10. A process control part 5 comprises a function as a data teaching means, and when, with a position data stored in a memory part 3, a correspondence relationship is specified at the U1 part 4, the teaching data about the to-be-connected semiconductor device 6 is extracted, and transmitted to the wire bonding device 10. |
