| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which can suppress water absorption into a resin-sealed structure to prevent peeling-off or cracking caused by reflow, and also to provide a method for fabricating the device. SOLUTION: Highly absorptive polymer 11 is provided on or in the interior of a resin-sealed structure 9 for packaging a semiconductor element 1. The presence of the highly absorptive polymer 11 causes invasion of water into the resin-sealed structure 9 to be suppressed and the water present in the interior of the polymer to be properly kept therein, thereby eliminating peeling-off or cracking of the structure 9. The highly absorptive polymer 11 itself is very high in its water absorption and can absorb and hold as much water as several ten to several hundred times its own weight. When the highly absorptive polymer 11 is coated onto the resin-sealed structure 9, the highly absorptive polymer 11 can absorb and hold water and also suppress water penetration into the resin-sealed structure 9. The highly absorptive polymer 11 may be embedded into an uppermost layer of the sealed resin structure 9, or particles of the highly absorptive polymer 11 may be dispersed and mixed into the resin-sealed structure 9. |
