| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device, with high reliability due to resin sealing, in which an external connection terminal is assigned almost vertically. SOLUTION: Using a plate 6 with positioning hole for mounting a semiconductor part, such as a power semiconductor element, etc., comprising an other part 1, a substrate 4, a heat radiating plate 5, a main terminal 2 and a control terminal 3, and sealing them with a resin 7, a resin sealing type power semiconductor module structure of low cost and high reliability is achieved. In a molding die, etc., using a structure in which a heat resistant adhesive tape 26 and a flexible material, etc., are provided at a terminal inserting part of an upper die 20, or using a dam part for terminal parts 2 and 3, the resin sealing type power semiconductor module structure of low cost and high reliability is achieved. Further, in the case where the main terminal 2 part employs screwing connection, it is easily integrated with a sealing resin by using a screw part, thereby achieving the resin sealing type power semiconductor module structure of low cost and high reliability.</p> |
