发明名称 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a high-power light-emitting element, without making large the space between the respective two leads of the lead groups of a lead frame by giving to it an envelope made of a light transmitting resin and having a non-circular structure with major and minor axes by disposing the minor axis in parallel with a line, whereby the two leads of the lead frame are connected, and by disposing the major axis vertically to the minor axis. SOLUTION: Making the sectional shape of an envelope 7 of a semiconductor light- emitting device a non-circular shape having major and minor axes and being symmetric as to the respective axes, the envelope 7 is disposed so that the minor axis is parallel with a line, whereby two leads of a lead frame are connected and the major axis is vertical to the minor axis. Accordingly, the major axis can be lengthened without changing the space between respective two leads 2, 2' of the lead group of the lead frame. Since the area of the envelope 7 can be made larger than the circle having the length of the minor axis as its diameter, the external efficiency of a light-emitting element 3 is improved to make increasable an optical power outgoing from a semiconductor light-emitting device to the outside. As a result, without making the space between the respective two leads of the lead group of the lead frame large, a high optical power can be obtained.
申请公布号 JPH10117020(A) 申请公布日期 1998.05.06
申请号 JP19970300089 申请日期 1997.10.31
申请人 TOSHIBA CORP 发明人 KAWAMOTO SATOSHI;FUJIMURA NORIO;TANAKA TOSHIAKI
分类号 H01L23/28;H01L33/54;H01L33/56;H01L33/62 主分类号 H01L23/28
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