| 摘要 |
PROBLEM TO BE SOLVED: To analyze a relation between occurrence of defects in appearance and corresponding chip product characteristics by outputting a degree of the number of inspected works for a degree of defects in appearance from inspection data of the defects in appearance of the inspected works. SOLUTION: Data analysis stations 2, 5, 8 for analyzing respective analysis data are provided outside a clean room 13 on a foreign material inspection device 1, an appearance inspection device 4 and a probe inspection device 7 and coupled via communication lines 3, 6, 9 between the devices and the stations. respectively. The data analysis stations 2, 5 have chip arrangement information on a wafer respectively for each type, judge to which chip a defect in appearance belongs from a coordinate of the detected defect in appearance and counts the number of occurring defects on each chip. In addition the data analysis stations 2, 5 perform analysis based on the number of defects in appearance on the wafer, the coordinate, the number of defects in appearance in a chip and product characteristic data or the like for each chip from the data analysis station 8. Thus a causal relation between the defect in appearance and product characteristics can be clear. |
