| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-encapsulated semiconductor device having a large chip in a small package and having a structure owing to which mechanical stresses generated in forming leads can be lessened by reducing thermal stresses in wire bonding parts and structure parts and by securing sufficient lengths of buried leads so as to reduce the size at least in the longitudinal direction of an LSI chip. SOLUTION: This semiconductor device is provided with an LSI chip 5 having multiple bonding pads 1 and multiple leads which are arranged in the longitudinal direction of the chip 5, and have at lest required slanted parts at their inner leads 7. The bonding pads are disposed in the center part of the LSI chip 5 in line, and the angle of inclination of each of the slanted parts of the leads 7 becomes larger toward the end side of the LSI chip. It is desirable that the widths of the inner leads 7 are narrowed toward the bonding pads 1. |
