| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a resin composition which is suitable as a resist ink capable of being developed with a dilute aqueous alkali solution and capable of giving cured films excellent in adhesion, soldering-heat resistance, electroless gold plating resistance, etc., by using an unsaturation-containing polycarboxylic acid resin having a specified composition. SOLUTION: This composition comprises an unsaturationcontaining polycarboxylic acid resin being a reaction product of a reaction product of an epoxy resin represented by the formula (wherein R1 is a 3-10C alkyl; and n is 0-30) with an unsaturation-containing monocarboxylic acid with a polybasic acid anhydride, a photopolymerization initiator and a diluent. The acid value (mgKOH/g) of the unsaturation-containing polycarboxylic acid resin is desirably 60-120. It is desirable that the amount of the unsaturation-containing polycarboxylic acid resin is 10-80wt.% based on the composition, that of the photoinitiator is 0.5-20wt.% and that of the diluent is 5-80wt.%.</p> |
