| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and an apparatus for cooling a wafer (workpiece) wherein heat conduction is substantially improved and the wafer is cooled very quickly. SOLUTION: The apparatus is provided with a heat conductive pedestal 206, and an electrostatic chuck 200 having electrodes 220 and 222 is provided on the pedestal 206 for electrostatically holding a workpiece. The electrostatic chuck electrostatically holds the workpiece by thermally contacting with the support surface so as to substantially improve heat conduction from the workpiece to the pedestal. Such close contact between the workpiece and the chuck facilitates the use of a backside cooling technique to further promote the conduction of heat to the chuck.</p> |
