| 摘要 |
PROBLEM TO BE SOLVED: To provide an inner lead carrier tape with a fine pitch. SOLUTION: When a first trace 11, second traces 12 and pitch-changing traces 14 are formed by etching a metal film 8, the second traces 12 and the pitch-changing traces 14 are made thinner than the first trace 11. The first trace 11 is formed on a film tape 3, the second traces 12 are formed in a hole 15 formed in the film tape, and the pitch-changing traces 14 are formed on the resin film formed in the hole 15. Thereby, it is possible to connect the second traces 12 with the finer pitch with the first trace 11 with the larger pitch through the pitch-changing traces 14 without causing short circuit. The first trace 11 can be used for connection with a liquid crystal board, and the second traces 12 can be used for connection with a semiconductor device. |
