发明名称 MANUFACTURE OF HEAT INSULATING PANEL
摘要 PURPOSE:To obtain a heat insulating panel having no back plate and useful for a flooring or the like, by applying a self-adhering foamable synthetic resin composition into the inside of a panel comprising a surface plate with frames secured to the undersurface thereof, convering the applied composition surface with a sheet, and foaming the composition. CONSTITUTION:To the periphery of the undersurface of the surface plate 1 comprising a plywood of the like are secured frames 2, to the inside thereof is applied the self-adhering and foamable synthetic resin composition (for example: a polyurethane or polystyrene foamable composition), and after the surface of the composition is covered with a sheet 4 of paper, cloth or the like, the composition is foamed spontaneously or by heating to obtain the heat insulating panel. In another embodiment, as shown in Fig. 1, when the panels are laminated and then foaming is carried out, since the panel serves as a press, a panel with the foamed smooth surface can be obtained. In this case, the sheet 4 acts as releasing agent, thereby, it does not adhere to the upper panel.
申请公布号 JPS5715937(A) 申请公布日期 1982.01.27
申请号 JP19800090915 申请日期 1980.07.02
申请人 EIDAI CO LTD 发明人 NISHIKAWA NORIO
分类号 B32B5/20;B29B7/00;B29C39/00;B29C39/10;B29C39/26;B29C44/14 主分类号 B32B5/20
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