| 摘要 |
PURPOSE:To improve a mold which is used to stick a rubber plate for mounting a wafer to a wafer retaining part of an ion implanter, and make said mold contribute to the adhesion between the rubber plate and the wafer and the sticking prevention of the wafer. CONSTITUTION:A mold 25 is brought into a fixed state on the peripheral part. The surface to be worked is subjected to milling under the state that a pressing force is applied to the central part of a surface of the mold which surface is opposite to the surface to be worked. Thereby the surface to be worked is turned into a recessed spherical surface. A rubber plate is set on a wafer retaining part in the manner in which the recessed spherical surface is used as the pressing surface against the rubber plate. |
