| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer take-out device in which many wafers pilingly housed in a cassette submerged in water can be surely taken out one by one. SOLUTION: At first, wafers W, W,... housed in a cassette 10 are raised up to a fixed position on the water surface independently of the cassette. Then, the wafer Wa positioned on the uppermost step is adsorptively held with a adsorption pad 55 in a state of stand-by over it. Next, the wafer Wa adsorptively held with the adsorption pad 55 is brought down, and submerged in a washing water tank 11. Washing liquid is jetted from a liquid jet nozzle 62 toward the wafer Wa adsorptively held with the adsorption pad 55 in the washing liquid. Hereat, when the wafers on and after the second step are adsorption on the underside of the wafer Wa adsorptively held with the absorption pad 55, they are shaked down by the liquid flow of the washing liquid jetted from the jet nozzle 62, and hence after shaking them down, the wafer Wa is raised and taken out. |
