| 摘要 |
PROBLEM TO BE SOLVED: To reduce the area of mounting for cost reduction, by bonding the electrode pads on the semiconductor chip sealed in a resin package to metal films exposed on almost the same level with the bottom of the resin package using a bonding wire. SOLUTION: One end of a bonding wire 13 is bonded to an electrode pad 12 on a semiconductor chip 11, and the other end is bonded to a metal film 15 exposed on the bottom of a resin package 14 made of mold resin. The metal films 15 are almost flush with the bottom of the resin package. The metal films 15 are 0.4mm in width, 0.75mm in length, and 10μ in height, each, and placed with a pitch of 0.65mm. Because of this structure it is unnecessary to route wires to the inner leads and outer leads of IC, and the area can be reduced accordingly. |
