| 摘要 |
PROBLEM TO BE SOLVED: To accurately align the head parts of connection pins in parallel to insert the connection pins into a plurality of insertion holes of a multilayer wiring substrate. SOLUTION: As a temporary insertion, connection pins 4 are first inserted to the half of pin parts 6 into the respective insertion holes 2 of a mutilayer wiring substrate 1 with the head parts 5 of the connection pins 4 being oriented in the alignment direction. After the head parts 5 of the connection pins 4 are floated above the top face of the mutually wiring substrate 1 by a dimension H as shown in Fig.(A), real insertion shafts 23 rectification grooves 29 of which are oriented in the alignment direction are positioned above the respective connection pins 4, the real insertion shafts 23 are pushed down with the two faces of the rectification grooves 29 abutting the both sides of the top ends of the head parts 5 if connection pins 4, and the pins 4 are pushed in until their head parts 5 come into contact with the top face of the multilayer wiring substrate 1 to insert the entire pin parts 6 in the insertion holes 2. In this case, even of the head parts 5 of the connection pins 4 are inclined by an angleθas shown in Fig.(A), the rectification force of the rectification grooves 29 reliably rectifies the angle of inclinationθso that the head parts 5 of the connection pins 4 are aligned in a normal direction.
|
