| 摘要 |
PROBLEM TO BE SOLVED: To improve a signal transmission speed and reduce electrical noise, by fixing an inner lead portion to a circuit forming surface by an insulating adhesive partially formed at a portion where a circuit forming surface faces the inner lead portion, thereby reducing stray capacity between the semiconductor chip and the lead. SOLUTION: An interval between a semiconductor chip 1 and a portion at the outer lead side from a portion adhered to an insulating film 4 of an inner lead 3A formed to a lead frame is made wider than the interval between the semiconductor chip 1 and a portion joined to the insulating film 4 by means of a stepped structure. Also, the bonding between the main surface of the semiconductor chip 1 and the insulating film 4 and the bonding between the insulating film 4 and the inner lead 3A is performed through an adhesive 7. By doing this, the stray capacitance between the semiconductor chip and lead can be reduced smaller and the signal transmission speed can be improved and electrical noise can be reduced. |
