发明名称 OPEN/CLOSE COVERING DEVICE FOR CUTTING AREA AND DICING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent splashes adhered to an open/close cover of a dicing device during cutting from dropping in the form of water drops and contaminating an operating panel or the floor in front of the device. SOLUTION: Open/close covers 13, 14 and 15 for a cutting area A are positioned in front of a cutting means of a dicing device 1 and are joined to the device at their upper ends by hinges 13a, 14a and 15a so that they may open and close. A splash inhibiting plate 17 is suspended through the hinge inside the cover 14 and a guide 19 for restricting the movements of the splash inhibiting plate 17 is provided on an inner side wall of the cutting area A. Splashes produced in the cutting area A are adhered to the inside of the splash inhibiting plate 17 and drop from the plate 17 when the cover is open. Since the splash inhibiting plate 17 is suspended and does not pass in front of the dicing device 1, an operating panel 16 and the floor in front of the device 1 are not contaminated. Also, since movements of the splash inhibiting plate 17 are restricted by the guide 19, it does not swing and does not touch the cutting device accordingly.</p>
申请公布号 JPH10116802(A) 申请公布日期 1998.05.06
申请号 JP19970179719 申请日期 1997.07.04
申请人 DISCO ABRASIVE SYST LTD 发明人 MORI TAKASHI
分类号 B23Q11/08;H01L21/301;H01L21/677;H01L21/68;(IPC1-7):H01L21/301 主分类号 B23Q11/08
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