发明名称 |
Etch chamber having three independently controlled electrodes |
摘要 |
An etch chamber for anisotropic and selective etching of a semiconductor wafer contains a dielectric window (34) and an externally located first electrode member (36) adjacent to the dielectric window for generating a plasma within the chamber. A second electrode member (42) is located within the chamber for exciting the plasma generated by the first electrode member. A third electrode (48) is located between the first electrode member and the dielectric window for sputtering the dielectric window to provide sidewall passivation for anisotropic and selective etching of a semiconductor wafer located within said chamber. Each electrode member is powered by its own separate RF generator. This arrangement enables the independent control of each of the three electrode members to optimize the etching of the semiconductor wafer located within the chamber. <IMAGE>
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申请公布号 |
EP0840348(A1) |
申请公布日期 |
1998.05.06 |
申请号 |
EP19960117636 |
申请日期 |
1996.11.04 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
GREWAL, VIRINDER S.;LAUX, VOLKER B. |
分类号 |
H01J37/32;(IPC1-7):H01J37/32 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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