| 摘要 |
PROBLEM TO BE SOLVED: To eliminate polishing sagging and to uniformly polish a polishing surface by polishing the polishing surface by making a lower surface of a guide ring in a state to form the same flat surface as the polishing surface of a thin plate type substrate. SOLUTION: A semiconductor wafer S is pressed by specified pressing force on a polishing pad surface of a polishing surface plate through a rotation axis 21 and a universal coupling 21A by lowering substrate holding device 2 holding the semiconductor wafer S, and gas is supplied to a guide ring 24 through a through hole 2101 of the rotation axis 21, a pipe 26 and a bellows 25, and pressure is added to it. In this case, a flat lower surface 2401 of the guide ring 24 is prevented from lowering as it collides against the polishing pad surface, contracts the bellows 25 against pressing force and is positioned in the same flat surface as the polishing surface of the semiconductor wafer S. Additionally, the polishing surface of the semiconductor wafer S is polished with a polishing pad and an abrasive liquid. |
