| 摘要 |
PROBLEM TO BE SOLVED: To improve the light-emitting efficiency of a light-emitting element and reduce its chip size by providing its bonding positions in its corner portions. SOLUTION: On a sapphire substrate 1, an n-type layer 2 and a p-type layer 3 are laminated in succession to form a light-emitting element. Then, etching a corner portion of the p-type layer 3, an electrode 4 is formed in a corner portion of the n-type layer 2 to connect the electrode 4 with a lead frame by wire-bonding via a gold wire 7. Also, a linear electrode 5 is formed on the p-type layer 3. The position of the wire-bonding of the electrode 5 is provided in a corner portion of the p-type layer 3. That is, the bonding positions of the electrodes 4, 5 are made to be both the ends of the diagonal, as observed from the same plane side. Therefore, the area of the p-type layer 3 can be made large to make a light-emitting of an extensive area obtainable. Also, the light-emitting can be taken out to the outside with its reduced screening by a ball 6. As a result, the light-emitting efficiency of the light-emitting element can be improved. |
