| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier package that can have more pins with fine pitches by simplifying alignment when it is connected with external devices. SOLUTION: Leads 4, 5 are formed from the overcoat area 3, formed in the central portion of a base film 2 composed of resin, such as polyimide, and input-side outer leads 4a and output-side outer leads 5a are formed in such a manner that they extend toward both the edges of the base film 2. A notch 6 is formed in the base film 2 between the output-side outer leads 5a. Thus the respective regions 2a, 2b expands independently during thermocompression boding. The notch 6 is formed almost at the central portion of the base film 2 in the direction of length, and the output-side outer leads 5 of the same number (e.g. 256 leads) are formed on both sides of the notch with a pitch of approx. 70μm. |
