| 发明名称 |
Method for producing electronic components using vacuum-thermoformed packaging boards |
| 摘要 |
The invention relates to a cost-effective and economical method for producing annular-core inductors for use in electronic apparatuses, packaging units being produced at the same time which are not broken down into individual parts until received by the user. |
| 申请公布号 |
DE3129650(A1) |
申请公布日期 |
1983.02.17 |
| 申请号 |
DE19813129650 |
申请日期 |
1981.07.28 |
| 申请人 |
VOGT GMBH & CO KG |
发明人 |
VERZICHT DES ERFINDERS AUF NENNUNG |
| 分类号 |
H01F41/04;H01G13/00;(IPC1-7):B65D85/42;H01L21/56 |
主分类号 |
H01F41/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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