发明名称 |
Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages |
摘要 |
A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.
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申请公布号 |
US5747095(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19970800945 |
申请日期 |
1997.02.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MCALLISTER, MICHAEL;PERFECTO, ERIC DANIEL;MCDONALD, JAMES;PRASAD, KESHAV;ROBBINS, GORDON J.;PRASAD, CHANDRIKA;SWAMINATHAN, MADHAVAN;WHITE, GEORGE EUGENE |
分类号 |
H01L21/48;H01L23/538;H05K3/00;H05K3/22;H05K3/46;(IPC1-7):B05D5/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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