Semiconductor laser device and optical pickup head

摘要

A semiconductor laser device comprising a first lead having a chip mounting part provided at the front end, at least one second lead separated from the first lead, a semiconductor laser element mounted on the chip mounting part, connecting means for electrically connecting the electrode of the semiconductor laser element and at least one second lead, and a frame body made of insulating material disposed so as to surround the semiconductor laser device and connecting means, and fixed to the first lead and second lead. In this semiconductor laser device, transparent resin is not used for sealing, and hence deterioration of light exit characteristic does not occur. Besides, because of the structure of fixing the leads to the frame body, it is rigid and excellent in reliability, and a multiplicity can be manufactured at once, so that it is easy to manufacture and is excellent in mass producibility.