| 摘要 |
The present invention relates to a gripping device (1) for removing and transporting several separate parallel-lying wafers (3) that are stored in a container (4). Said device has a holder (10) and several gripping heads (6; 6') that are displaceable and rotatable with respect to the holder (10). Said heads (6; 6') can be transported from one swinging position between the wafer (3) to another swinging position. In this position, the gripping heads (6; 6') can be displaced against the borders of the wafer (3), where they come to a limiting stop and push in simultaneously the opposite borders of the wafer flanks (3) in the slot (11) of the holder (10). In this manner all wafers (3) inside the container (4) can be simultaneously grabbed safely, displaced from the container (4) and swung out. In swing position, the vertically-positioned wafers (3) can be placed on a processing support (5). |
