发明名称 |
Deposition of silver layer on nonconducting substrate |
摘要 |
A thin silver layer is deposited on the surface of a nonconducting substrate using an electroless process. The surface is cleaned and activated in aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt in the absence of an electric current, but in the presence of a deposition control agent. Optionally, the silver layer is stabilized with an aqueous solution of a platinum-group metal and/or gold. The resulting silver layer is uniform and of 2-2000 ANGSTROM thickness; it strongly adheres to the substrate.
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申请公布号 |
US5747178(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19950399281 |
申请日期 |
1995.03.06 |
申请人 |
ADTECH HOLDING |
发明人 |
SODERVALL, BILLY VALTER;LUNDEBERG, THOMAS |
分类号 |
A61L2/16;A01N25/10;A01N59/16;A61L29/10;A61L29/16;C23C18/28;C23C18/30;C23C18/44;(IPC1-7):B32B15/04;B32B27/00 |
主分类号 |
A61L2/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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