发明名称 |
Semiconductor device and semiconductor module |
摘要 |
It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.
|
申请公布号 |
US5747876(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19960680614 |
申请日期 |
1996.07.16 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MAJUMDAR, GOURAB;MORI, SATOSHI;NODA, SUKEHISA;IWAGAMI, TOORU;TAKAGI, YOSHIO;KAWAFUJI, HISASHI |
分类号 |
H01L23/28;H01L23/24;H01L23/36;H01L23/433;H01L23/495;H01L25/07;H01L25/16;H01L25/18;H05K1/02;(IPC1-7):H01L23/22 |
主分类号 |
H01L23/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|