| 摘要 |
PURPOSE:To form a pattern even near a substrate terminal, and to increase the density of mounting by protecting an element easy to be affected by solder by a water-soluble resist. CONSTITUTION:A section 8 in which the adhesion of solder grains and the immersion of solder are avoided is coated selectively with a water-soluble resist at the inside except the end edge of a substrate in which conductor terminals 1 are formed. The water-soluble resist is used in order to prevent the dissolution of the resist by the solvent of the solder flux. The terminals 1 are soldered, and washed by water, and the resist is removed. According to this constitution, the density of mounting can be improved more than conventional circuits because a thin-film capacitor can be brought near up to approximately 300mum from the fringe of the substrate. |
