发明名称 |
Method of applying a film to a substrate |
摘要 |
A film is applied to a substrate in accordance with a predetermined pattern by applying a solution of a copolymer of fluoropolymers dissolved in a solvent onto the surface of the substrate; curing and annealing the solution to boil off the solvent and form a copolymer film on the substrate; depositing a thin metal film on the copolymer film; patterning the thin metal film by a photoresist etching process to expose the underlying copolymer film in accordance with the predetermined pattern; removing the exposed copolymer film so that the underlying substrate is exposed in accordance with the predetermined pattern; removing any remaining thin metal film; depositing the film to the remaining copolymer film and exposed substrate; then removing the remaining copolymer film and any film applied thereon by ultrasonic cleaning.
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申请公布号 |
US5747117(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19970869130 |
申请日期 |
1997.06.04 |
申请人 |
SERVO CORPORATION OF AMERICA |
发明人 |
DANNENBERG, RAND |
分类号 |
H05H1/00;(IPC1-7):H05H1/00 |
主分类号 |
H05H1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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