发明名称 Method of applying a film to a substrate
摘要 A film is applied to a substrate in accordance with a predetermined pattern by applying a solution of a copolymer of fluoropolymers dissolved in a solvent onto the surface of the substrate; curing and annealing the solution to boil off the solvent and form a copolymer film on the substrate; depositing a thin metal film on the copolymer film; patterning the thin metal film by a photoresist etching process to expose the underlying copolymer film in accordance with the predetermined pattern; removing the exposed copolymer film so that the underlying substrate is exposed in accordance with the predetermined pattern; removing any remaining thin metal film; depositing the film to the remaining copolymer film and exposed substrate; then removing the remaining copolymer film and any film applied thereon by ultrasonic cleaning.
申请公布号 US5747117(A) 申请公布日期 1998.05.05
申请号 US19970869130 申请日期 1997.06.04
申请人 SERVO CORPORATION OF AMERICA 发明人 DANNENBERG, RAND
分类号 H05H1/00;(IPC1-7):H05H1/00 主分类号 H05H1/00
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