| 摘要 |
A heat sink support device including a base and a top member is provided to support a finned heat sink attached to a processor card assembly of a computer system. The base member includes a number of dowels disposed on a bottom surface for securing the base member to a motherboard. The base member also includes a number of necked pins disposed on a top surface, and the top member includes a number of cutouts disposed on an edge for mating with the necked pins, to render a set of the fins captive, to prevent the heat sink from moving beyond the tolerance allowed between the fins and the base and top members.
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