| 摘要 |
The solid-state image sensor disclosed includes a package accommodating an image sensor element chip, and a plurality of wiring patterns carried by a flexible printed wiring circuit board. Each of the wiring patterns is a continuous seamless pattern and has electrode portions for connection with the element chip and for connection with circuit components, and a wiring portion disposed between those electrode portions. The flexible printed wiring circuit board is capable of being bent, extends through and out from the package, and is unitary with the package. The arrangement enables the compact accommodation of the element chip together with other components and the reduction in the number of steps for the fabrication.
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