发明名称 LEAD FRAME MEMBER AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To make a coupling portion unnecessary, which was used for fixing inner leads together during outer shape processing of a lead frame, by filling a space between thinned inner leads with an insulating adhesive, and by fixing the tip portion of the inner lead in a state where the insulating adhesive is hardened. SOLUTION: A tip portion of each inner lead 112 provided at a lead frame 110 is formed thinner than the thickness of the raw material of the lead frame, which is called a thin wall portion 112A. Then, a space between the inner leads 112 is filled up with an insulating adhesive 120, and the tip portion of each inner lead 112 is fixed in a state where the insulating adhesive is hardened. Here, the thickness of the insulating adhesive 120 should have a thickness almost equal to a thin wall portion 112A. Also, as an insulating adhesive 120, for example, photosensitive polyimide resin of ultraviolet hardening type is used. By doing this, at the time of outer shape processing of lead frame, a coupling portion connecting inner leads together is made unnecessary, and thus the productivity can be improved.</p>
申请公布号 JPH10116957(A) 申请公布日期 1998.05.06
申请号 JP19960289051 申请日期 1996.10.14
申请人 DAINIPPON PRINTING CO LTD 发明人 SASAKI MASAHITO
分类号 H01L23/48;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/48
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