发明名称 |
Method and apparatus to wick solder from conductive surfaces |
摘要 |
A system for removing solder from an area grid array pad by applying a wire mesh to a conductive surface of the area grid array that is covered with solder. Heat is applied to the wire mesh and the conductive surface of the area grid array so that the solder flows from the conductive surface onto the wire mesh. The wire mesh is removed from the conductive surface thereby removing all solder from the conductive surface of the area grid array.
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申请公布号 |
US5746367(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19960629280 |
申请日期 |
1996.04.08 |
申请人 |
CERIDAN CORPORATION |
发明人 |
PAI, DEEPAK KESHAV;LUND, LOWELL DENNIS |
分类号 |
B23K1/018;H05K13/04;(IPC1-7):B23K3/00 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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