| 摘要 |
A method of compounding a multimodal, preferably a bimodal polymer composition comprising a low molecular weight ethylene polymer and a high molecular weight ethylene polymer is described. The composition is compounded during a relatively long time at a low temperature which lies in a narrow temperature range including the melting point of the low molecular weight ethylene polymer. More particularly, the polymer composition is compounded, without addition of a heat transfer medium, in a temperature range from about 10 DEG C below to about 10 DEG C above the melting point of the low molecular weight ethylene polymer during a time of more than 10 seconds. The viscosity ratio between the ethylene polymers in said temperature range preferably is from about 5:1 to about 1:5. |
