HEAT-AGING-RESISTANT POLYAMIDE RESIN COMPOSITION AND FIBER COMPRISING THE SAME

摘要

There are provided a heat-aging-resistant polyamide resin composition comprising (C) 100 wt. parts of a polyamide containing 10 to 100 % by weight of (A) a polyamide obtained by polymerizing a diamine compound containing at least 70 mole % m-xylylenediamine and a dicarboxylic acid component containing at least 70 mole % adipic acid and the rest of (B) other polyamide, (D) 0.001 to 0.1 wt. part of a copper compound, (E) 0.005 to 1 wt. part of a halide of a Group 1 or Group 2 metal of the Periodic Table, an ammonium halide, or an organohalide at least one of (F) 0. 05 to 3 wt. parts of a hindered phenol and (G) 0.05 to 3 wt. parts of a hindered amine, and (H) 0.05 to 3 wt. parts of an organophosphorus compound and a fiber made of the polyamide resin composition.