发明名称 PROCEDIMENTO PER LA DISPOSIZIONE DI PISTE CONDUTTRICI SULLA SUPERFICIE DI COMPONENTI A SEMICONDUTTORI
摘要 In a process for arranging printed conductors on the surface of a semiconductor component, printed conductors connect wire ranges that are designed as polygons. The polygons are composed of individual edge points. With regard to each of these edge points, it is determined whether it can be connected by a printed conductor running parallel to the coordinate system or diagonally to the coordinate system. Additional edge points may also have a "not connectable" status.
申请公布号 IT1283814(B1) 申请公布日期 1998.04.30
申请号 IT1996MI01764 申请日期 1996.08.21
申请人 ROBERT BOSCH GMBH 发明人 ROEDEL CARSTEN;SCHEIBLE JUERGEN
分类号 H01L23/485 主分类号 H01L23/485
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