发明名称 MAGNETRON SPUTTERING TARGET
摘要 PURPOSE:To suppress the sputtering phenomenon on the side face of a target body and to improve the quality of a sputtering thin film by using a soft magnetic material to form the side face of the target body in a magnetron sputtering device. CONSTITUTION:The target 1 is held with the target body 2 brazed with a thin film 8 made of the soft magnetic material in the stage of forming the target 1 as a thin target material film by a sputtering phenomenon on the substrate surface in the magnetron sputtering device. The target 1 forms the thin film on the substrate by the sputtering phenomenon as a result of the collision of the positive ions generated in a high-density plasma region 6. There is the soft magnetic material on the side face of the body 2 in this case and therefore magnetic lines of force 9 by a magnet 3 do not leak to the outside and the thin film consisting of the target material having high quality is formed without contamination of the thin film by the target material on the substrate owing to the sputtering phenomenon.
申请公布号 JPS61578(A) 申请公布日期 1986.01.06
申请号 JP19840122814 申请日期 1984.06.14
申请人 NICHIDEN ANELVA KK 发明人 UEKI MASAYUKI
分类号 C23C14/36;C23C14/34;C23C14/35 主分类号 C23C14/36
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