发明名称 Multistage low pressure plasma cleaning process
摘要 In a process and arrangement for low pressure plasma treatment of parts, the process is carried out in several successive steps with different process parameters and process gases. Preferably, the process involves two or more of degreasing (preferably with oxygen or an oxygen-containing process gas), reducing (preferably with hydrogen or a hydrogen-containing process gas) and sputter etching (preferably with argon, another inert gas or an inert gas mixture). A coating or nitriding operation may be carried out immediately after the treatment, without breaking the vacuum.
申请公布号 DE19644153(A1) 申请公布日期 1998.04.30
申请号 DE19961044153 申请日期 1996.10.24
申请人 GESCHE, ROLAND, DR., 63500 SELIGENSTADT, DE 发明人 GESCHE, ROLAND, DR., 63500 SELIGENSTADT, DE
分类号 B08B7/00;C23C4/02;C23C8/02;C23C14/02;C23C16/02;C23G5/00;(IPC1-7):C23F4/00 主分类号 B08B7/00
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