| 摘要 |
PURPOSE:To improve the moisture resistant characteristics of molded electronic part, by a method wherein, after the surface of an electronic component dipped with epoxyphenol resin which is then cured, a moisture resistant material is impregnated to fill holes made in the hardened epoxyphenol resin. CONSTITUTION:The first resin layer 2 is formed on the surface of an electronic part 1 by dipping it in epoxyphenol resin. Next the second resin layer 3 is formed by thinly dipping it in the resin and impregnating an impregnable resin such as silicon resin or epoxy resin or polybutadiene resin etc. with excellent heat resistance and low viscosity as well as hardening said impregnable resin on the surface of resin layer 2. Successively the third resin layer 4 is formed by repeating a similar process of dipping and curing using epoxyphenol resin on the surface of the resin layer 3. Finally the resin layer 4 is impregnated with moisture resistant material such as wax like a paraffin etc. to fill numerous pores made inside epoxyphenol resin formed into the resin layer 4 with the moisture resistant material to form a stable moisture resistant skin film on the surface of an electronic part. |
