| 摘要 |
Rectification or modification of line of metal on a first substrate (23) comprises: (a) arranging a second substrate (21), presenting a metal coating (22) on one of its surfaces, at a distance from the first substrate (23) in a manner such that the line of metal on the first substrate may be adjacent to the surface of the second substrate (21) with the metal coating (22); (b) removing by ablation the metal coating (22) in order to emit some ions (25) from the metal coating (22); and (c) applying an electric field to the second substrate (21) and to the line of metal in order to drive the ions (25) towards the line of metal and to contribute, by an electrostatic effect, to the adherence of these ions (25) to the line of metal. The adherence may then be improved by heating the substrate (23), for example using a laser beam. The substrate with a line of metal rectified or modified by this method and the equipment used to affect this rectification or modification are also claimed.
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