| 摘要 |
<p>The invention concerns a device for mounting electrical and electronic components (3) on printed-circuit boards or hybrids (1) with low thermal expansion, such as thermally stressed high-frequency power transformers on printed-circuit boards (1) made of aluminium oxide-ceramics. The component (3) comprises through-holes (6) which pass through a contact plate (7). Disposed in each of the holes (6) is a metal pin (8) whose upper part is pressed into the contact plate (7) so that the metal pin thus forms a force-locking electrically conductive cold weld therewith. At its other end, the metal pin (8) is soldered flush, for example, to a printed conductor (2). The transverse dimension of the metal pin (8) is smaller than the diameter of the hole (6), such that the metal pin (8) has a given amount of freedom of movement. In this way, differences between the thermal expansion of the component (3) and the printed-circuit board (1) can be compensated.</p> |
