| 发明名称 |
Laser machining of molded assemblies |
| 摘要 |
<p>A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to the heat dissipating surface of the heat generating component. The window is formed using a laser. <IMAGE></p> |
| 申请公布号 |
EP0838981(A2) |
申请公布日期 |
1998.04.29 |
| 申请号 |
EP19970308386 |
申请日期 |
1997.10.22 |
| 申请人 |
VLT CORPORATION |
发明人 |
ANDRUS, LANCE L.;CURHAN, JEFFREY A. |
| 分类号 |
H01L23/36;H05K3/28;H05K5/00;(IPC1-7):H05K5/00;B23K26/00 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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