发明名称 |
Thermoelectric cooling device for thermoelectric refrigerator |
摘要 |
<p>A thermoelectric cooling element series 5 is constructed of heat-absorbing-side electrodes 8 arranged at predetermined intervals, p-type semiconductor layers 10 and n-type semiconductor layers 11 formed on the electrodes, and heatsink-side electrodes 12 connecting the p-type semiconductor layers 10 and the n-type semiconductor layers 11 together. The numerous p-type semiconductor layers 10 and n-type semiconductor layers 11 are arranged in parallel and are electrically connected in series (see FIG. 6) High thermal-conductivity silicone grease layers 17,17 are formed between the thermoelectric cooling element series 5 and the heat absorber 4 and between the thermoelectric cooling element series 5 and a heatsink 6, respectively. <IMAGE> <IMAGE></p> |
申请公布号 |
EP0838868(A2) |
申请公布日期 |
1998.04.29 |
申请号 |
EP19970203488 |
申请日期 |
1993.10.04 |
申请人 |
THERMOVONICS CO., LTD |
发明人 |
WATANABE, HIDEO;SAKAI, MOTOHIRO;HISANO, FUMIO;OSAWA, ATSUSHI;TEZUKA, HIROFUSA |
分类号 |
F25B21/02;F25D11/00;F25D19/00;H01L35/22;H01L35/30;H01L35/32;(IPC1-7):H01L35/30 |
主分类号 |
F25B21/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|