发明名称 |
Composition and process for filling vias |
摘要 |
Electrolytic and electroless processes which use a solid plug of polymer thick film composition to fill throughholes and composition therefor. The composition comprises a trimodal conductive mixture dispersed in an organic vehicle wherein the trimodal conductive mixture consists of particles of spherical silver, flake silver and silver-coated copper.
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申请公布号 |
US5744285(A) |
申请公布日期 |
1998.04.28 |
申请号 |
US19960683351 |
申请日期 |
1996.07.18 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
FELTEN, JOHN JAMES;PADLEWSKI, STEPHAN |
分类号 |
H01B1/22;H05K1/09;H05K3/24;H05K3/40;(IPC1-7):G03C5/00 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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