发明名称 SUBSTRATE FIXING METHOD FOR MBE SAMPLE AND ITS APPARATUS
摘要 PURPOSE:To form an uniform In metal layer between a wafer holder and a wafer, and fixing the wafer on the wafer holder with excellent uniformity, by pushing up a piston, and introducing molten In metal fluid into a gap between the wafer holder and the wafer to fill the gap. CONSTITUTION:An upper and of a cylinder 9 is provided with an aperture 16, a wafer-center hole 15 to introduce an In metal fluid 2 is drilled at the center of a wafer holder 1, and a heating apparatus 5 to melt an In metal and to maintain its state is installed around a cylinder 9. The flow rate of the In can be adjusted by the lift amount of a piston 10, and the In is supplied between the wafer holder and the wafer so as to be slightly superfluous. The superfluos In metal fluid which flowed out from a gap between the wafer holder 1 and the wafer 3 drops into a groove 4, and prevents a phenomenon that the In metal scatters on the wafer surface during MBE growth. Thus the wafer is fixed on the wafer holder by the effect of the In metal.
申请公布号 JPS62169323(A) 申请公布日期 1987.07.25
申请号 JP19860010592 申请日期 1986.01.21
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAJIMA KUNIMITSU;MURAI SHIGEO
分类号 H01L21/203;H01L21/26 主分类号 H01L21/203
代理机构 代理人
主权项
地址