MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device by connecting a pair of electrodes of substrates accurately and securely. SOLUTION: Since this device 10 has a magnetic substance piece 20 and a magnetic substance layer 26 each including a magnetic substance in a bump electrode 18 and a terminal electrode 30, the substrates can be connected with each other in accurate alignment by magnetic force by magnetizing them before alignment. Moreover, the malfunction and breakdown by magnetic force can be eliminated by demagnetizing it after completion of alignment thereby putting it in such condition that the terminal electrode 30 and the bump electrode 18 do not have magnetic force.